San Jose - Samsung Electronics Co. et launch tres-dimensional (3D) packaging servicia pro summus Bandwidth Memoria (HBM ad artificialem intelligentia chip scriptor sextus-generationem HBM4 ex in MMXXV.
De June XX, mundi maximae memoria chipmaker unveiled eius tardus chip packaging technology et servitium Roadmaps ad Samsung foro Forum MMXXIV tenuit in San Jose, California.
Hoc est primum Samsung ad dimittere 3D packaging technology ad HBM eu in publico eventu. Currently, HBM eu packaged maxime cum 2.5D technology.
Et factum est de duas hebdomades post NVIDIA co-conditor et dux exsecutiva Jensen Huang unveiled novae-generation architectura de eius Ai Platform Rubin per orationem in Taiwan.
HBM4 erit verisimile esse embedded in NVIDIA scriptor Novum Rubin GPU Model expectata ad ledo in foro in MMXXVI.
Vertical
Samsung est tardus packaging technology features HBM eu reclinant directe supra of a GPU ad ulterius accelerate data doctrina et consequentia processu, a technology tamquam ludum versus est in ieiunium, crescente ai changer in foro.
Currently, HBM eu sunt, cum a GPU in Silicon Interposor sub 2.5d packaging technology.
Per comparationem, 3D packaging non eget a Silicon Interposer, aut tenues subiecti qui sedet inter eu ut permiserit communicare et opus simul. Samsung dubs eius novus packaging technology ut S.-D, Short pro Samsung Provectus Interconnection technology-d.
Turnkey ministerium
Meridionalis Coreanica turba intelligitur offerre 3D HBM packaging in turnkey basis.
Ut faceret, ad provectus packaging quadrigis erit verticaliter Interconnect HBM eu produci in memoriam negotium division cum GPUS convenerunt ad Fabulas in Civitatum Unit.
"3D packaging reducit potestatem consummatio et processui mora, melior qualitas electrica annuit de semiconductor eu," dixit Samsung electronics publica. In MMXVII, Samsung consilia ad introducendam omnes-in-unum heterogenea integration technology quod incorporat optici elementa, quae dramatically auget notitia transmission celeritate of semiconductors in unum per sarcina ai accelerators in unum unum per sarcina ai accelerators.
In linea cum crescente postulant pro humilis-potentia, summus perficientur eu, HBM proiecta est facere XXX% de dram foro in MMXXV ex XXI% in MMXXIV, secundum trendeforce, a Taiwanese Company.
MGI Research Providii Packaging foro, inter 3D packaging, ut crescere ad $ LXXX billion per MMXXXII, comparari $ 34.5 billion in MMXXIII.
Post tempus: Iun-10-2024