Samsung Electronics 'Fabrica Solutions Division est accelerans progressionem a novus packaging materia dicitur "speculum Interponer", quod expectat reponere altum - sumptus Silicon Interposer. Samsung habet suscepit rogationibus ex Chemtronica et Philoptics ut develop hoc technology usura corning vitrum et active evaluating cooperante possibilities pro sua commercialization.
Meanwhile, Samsung Electro - Mechanics is also advancing the research and development of glass carrier boards, planning to achieve mass production in 2027. Compared with traditional silicon interposers, glass interposers not only have lower costs but also possess more excellent thermal stability and seismic resistance, which can effectively simplify the micro - circuit manufacturing process.
Nam electronic packaging materiae industria, hoc innovation potest adducere novum occasiones et challenges. Nostrum comitatu mos propinqua Monitor has technological progressiones et contendunt ut develop packaging materiae, quod potest melius par novum semiconductor packaging trends, cursus, quod nostra carrier tapes, operimentum et suscipio pro novus - generatio semiconductor.
Post tempus: Feb-10-2025